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1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology

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1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology

1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology
1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology 1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology 1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology 1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology

Duży Obraz :  1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology

Szczegóły Produktu:
Miejsce pochodzenia: Chiny
Nazwa handlowa: GNEE
Orzecznictwo: SGS
Zapłata:
Minimalne zamówienie: ≥1Sets
Szczegóły pakowania: Drewniane pudełko / opakowanie zewnętrzne
Czas dostawy: Czas tranzytu: est. 17-24 dni
Zasady płatności: Moneygram, Western Union, T/T, D/P, L/C, D/A.

1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology

Opis
Technologia: Adsorpcja huśtawki ciśnieniowej (PSA) Kolor: Biały
Stan: NOWY Zasilanie zasilania: 220 V/50 Hz
Wyjście: 950 Nm3/h (GOX) Ciśnienie wypełniające: 150 barów lub 200 barów
Instalacja: Zamontowany w poślizgu lub w pojemniku Czystość: 90%-94%
Stosowanie: Wytwarzać tlen Waga netto: 5,4 kg
Capaicty: 5 ~ 500 Nm3/h Typ: Adsorpcja
Podkreślić:

1200 Nm³/h PSA Oxygen Generator

,

99% High-Purity PSA Oxygen Generator

,

Electronic Chip Manufacturing Oxygen Plant

1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing

The PSA Oxygen Generator (Pressure Swing Adsorption PSA Oxygen Plants) is an ultra-high-purity oxygen supply equipment designed specifically for the electronics industry. Utilizing advanced pressure swing adsorption technology, it delivers stable oxygen production with 99% purity through multi-stage purification and precision separation processes.

Key advantages include minimal purity fluctuation, extremely low impurity content (total hydrocarbons ≤0.1ppm), and exceptional continuous operation capability. With a 1200Nm³/h flow rate, this model serves as a benchmark for PSA oxygen plant purity, meeting the ultra-high-purity oxygen requirements for critical chip manufacturing processes such as thin film deposition and oxidation.

Product Specifications
Oxygen Output (Nm3/h) Purity (%) Instrument Air Consumption (M3/h) Water Consumption (M3/h) Power Consumption (KW) Total Power (KW) Bed Layer Type Area (M3)
509010332.540vertical6 x 9
15090 ~ 9320156585vertical9 x 9
20090 ~ 93251586110vertical9 x 9
30090 ~ 933030132155vertical14 x 12
40090 ~ 934030172205vertical15 x 14
60090 ~ 935045258320vertical12 x 18
80090 ~ 936050344410vertical15 x 18
100090 ~ 936560436550vertical16 x 18
150090 ~ 939090675845vertical or horizontal18 x 18
200090 ~ 931001509001060vertical or horizontal18 x 24
1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology 0 1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology 1 1200 Nm³/h 99% High-Purity PSA Oxygen Generator for Electronic Chip Manufacturing with Pressure Swing Adsorption Technology 2
Strict Standards for Installation and Maintenance

Electronic chip manufacturing requires exceptional standards for PSA Oxygen Generator installation, focusing on three critical aspects: cleanliness, explosion protection, and pollution prevention.

  • Installation area: Requires ISO Class 8 cleanroom environment, positioned away from high-dust process areas like lithography and etching
  • Pipeline connection: Utilizes flange sealing with PTFE gaskets and helium mass spectrometry leak detection (leak rate ≤1×10⁻⁹Pa・m³/s)
  • Electrical system: Complies with ATEX explosion-proof standard (II 2G Ex d IIB T4) to eliminate electric spark hazards

Maintenance follows a rigorous "super-clean" protocol:

  • Daily maintenance: Remote monitoring of purity and pressure; no personnel access to core equipment areas
  • Monthly maintenance: Pre-filter element replacement performed in clean glove boxes to prevent contamination
  • Annual maintenance: Conducted by certified PSA oxygen generator manufacturers, including molecular sieve testing, catalyst evaluation, and pipeline cleanliness inspection with full cleanroom protocols

Special Note: Molecular sieve and catalyst replacements require inert gas protection to prevent air contact. Post-replacement, a 24-hour purity test is mandatory before returning to service. These protocols ensure equipment lifespan exceeds 10 years with consistent 99%+ purity.

The 1200Nm³/h PSA Oxygen Generator with 99% ultra-high purity has become essential for electronic chip manufacturing. Its advanced pressure swing adsorption PSA oxygen plants technology provides the stable, clean oxygen supply required for precision chip production processes, supporting the high-quality development of the electronics industry.

Szczegóły kontaktu
Henan Gnee New Materials Co., Ltd.

Osoba kontaktowa: Mrs. Kelly

Tel: +86 15824687445

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